|
3M产品 |
产品描述 |
导热性能 |
电特性 |
|
|
基材
类型 |
产品厚度
mil(mm) |
填充料
类型 |
导热系数W/m-k
(3M ASTM
D5470) |
热阻抗
℃-in2/W
(℃-cm2/W) |
介电强度
kv/mm |
体积强度
ohm/cm |
持续工作
温度范围（℃） |
|
|
3M导热油脂 |
TCG-2035/ TCG-2031*
TCG-2037/ TCG-2033*
|
无硅的有机混合物 |
/ |
陶瓷
陶瓷&金属 |
4.1
3.0 |
0. 0127（0.081）
0.0170（0.109） |
4.7
0.1 |
1.36X10E9
4.1X10E7
|
短期：125-140℃
长期：80-100℃ |
|
3M导热油脂是高性能的导热材料。广泛应用于CPU，图像处理芯片，高功率LED等领域。产品具有高的导热系数和低的热阻抗。目前有两个版本，一类是标准粘度，另一类是利于丝网印刷的低粘度版本。 |
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| 3M™ Thermally Conductive Grease TCG-2031 |
Low viscosity grease, designed for use in screen printing applications. Screen printing of this material results in a thin bond line and consequently higher thermal performance. |
| 3M™ Thermally Conductive Grease TCG-2033 |
A lower viscosity than 3M TCG-2037 which allows for a thinner bond line leading to improved thermal resistance and designed for use in screen printing applications. |
| 3M™ Thermally Conductive Grease TCG-2035 |
An ultra-high performance thermal interface material for transferring thermal energy from a heat source (e.g.: processor chip, graphics chip, etc.) to a heat sinking or heat spreading surface. |
| 3M™ Thermally Conductive Grease TCG-2037 |
A high performance thermal interface material for transferring thermal energy from a heat source (e.g.: processor chip, graphics chip, etc.) to a heat sinking or heat spreading surface. |
